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Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

نام تجاری: Hiner-pack
شماره مدل: HN24139
مقدار تولیدی: 500pcs
قیمت: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
شرایط پرداخت: 100% Prepayment
توانایی عرضه: 2000PCS/Day
اطلاعات دقیق
محل منبع:
شنژن چین
گواهی:
RoHS、ISO
روش قالب گیری:
قالب گیری تزریقی
دما:
80 تا 180 درجه سانتی گراد
Warpage:
کمتر از 0.76 میلی متر
بادوام:
بله
خدمات سفارشی:
پشتیبانی استاندارد و غیر استاندارد
اموال:
ESD، غیر ESD
قابل انباشته شدن:
بله
آنتی استاتیک:
بله
Packaging Details:
70~100pcs/carton(According To The Customer Demand)
Supply Ability:
2000PCS/Day
توضیحات محصول

Product Description:

The High Precision JEDEC Matrix Tray is engineered to deliver exceptional dimensional accuracy and stability for semiconductor packaging and component handling. Designed to meet JEDEC global standards, it offers a reliable solution for transporting, testing, and storing delicate devices within automated environments. Each pocket maintains precise geometry, ensuring components stay aligned and protected during multi-step production flows. The tray’s ESD-safe material provides consistent anti-static performance while withstanding long-term use in cleanroom and production settings.

Features & Benefits:

High Dimensional Accuracy – Maintains tight tolerances across all pockets, ensuring reliable component positioning in high-speed automation.

Global JEDEC Compatibility – Fully compliant with JEDEC standards for smooth interchangeability across equipment and supply chains.

Static Dissipative Performance – Stable ESD protection prevents electrostatic damage to sensitive devices.

Smooth Pocket Surface – Minimizes friction and particle generation during automated loading and unloading.

Structural Integrity – Reinforced frame enhances tray rigidity and prevents warping under operational stress.

Stackable Design – Interlocking edges allow secure stacking for compact storage and efficient logistics.


Technical Parameters:

Brand Hiner-pack
Model HN24139
Material MPPO
Package Type IC Component
Color Black
Resistance 1.0x10e4-1.0x10e11Ω
Outline Line Size 322.6x135.9x12.19mm
Cavity Size 30.4x15.5x7.65mm
Matrix QTY 6*8=48PCS
Flatness MAX 0.76mm
Service Accept OEM, ODM
Certificate RoHS, IOS

Applications:

This tray is designed for high-precision manufacturing environments requiring consistent alignment and handling of small to medium-sized components. Typical uses include IC assembly, semiconductor module packaging, high-reliability testing, and device storage. It performs effectively under robotic transfer systems, pick-and-place machinery, and automated conveyors, supporting stable operation in cleanroom or standard production conditions.

Customization:

The High Precision JEDEC Matrix Tray can be customized for unique production demands and specialized device geometries:

Tailored Pocket Designs – Adjust pocket shape and depth to suit varied device outlines or thicknesses.

Color Customization – Available in multiple ESD-safe color variants to support line management and batch identification.

Integrated Identification – Include molded markings or embedded codes for traceability and process control.

Automation-Ready Enhancements – Optional edge and corner modifications ensure compatibility with proprietary automation interfaces or specialized robotic systems.