High Profile Module Carriers For Complex PCB Assembly Protection Custom JEDEC Trays

Product Description:

The need for highly integrated, custom electronic sub-systems—often referred to as Modules or PCBA Assemblies—necessitates a robust, specialized handling solution that exceeds the capabilities of standard low-profile IC trays. Our High-Profile Module Carriers are precision-engineered to meet this demand. Adhering strictly to the JEDEC standard external outline of 12.7 x 5.35 inches but utilizing the crucial 0.40-inch (10.16mm) thickness, these carriers ensure ample vertical clearance for components with large heat sinks, mounted connectors, or multiple layers. Constructed from a high-modulus, carbon-filled conductive polymer, the tray serves as a comprehensive protection system: it offers maximum mechanical defense against stacking pressure and impact, while simultaneously ensuring reliable static dissipation.  The rigid structure and minimal warpage specification guarantee a consistently flat presentation to robotic pick-up heads, which is foundational for reliable, jam-free feeding in automated assembly and inspection lines.

Features:

Essential Vertical Clearance: The robust 0.40-inch profile is specifically engineered for tall components and complex PCBA modules, preventing crush damage and ensuring safe stacking without component-to-tray contact.
Maximized ESD Safety: Manufactured from Conductive PPE/MPPO polymers, the tray delivers a surface resistivity within the $10^{4}$ to $10^{6} Omega/text{sq}$ range, offering rapid static discharge essential for sensitive module electronics.
Universal Automation Interface: Adherence to the global JEDEC footprint guarantees plug-and-play compatibility with all standard automated handlers, stackers, and feeding equipment worldwide, protecting capital investment.
Superior Nesting Geometry: The custom-molded internal pockets are designed to securely capture the module’s body, preventing vibration damage and shifting, which is critical for modules containing sensitive MEMS or optics.
High Strength & Durability: Engineered for minimal twist and high deflection temperature, ensuring the tray maintains its dimensional precision and flatness over hundreds of usage cycles and varying environmental conditions.

Technical Parameters:

Applications:

These High-Profile Module Carriers are indispensable across high-reliability electronics manufacturing sectors. Primary applications include the transport and Work-In-Process (WIP) storage of sensor modules, RF communication assemblies, small embedded computing boards, and automotive electronics. They are widely used for the out-sourcing of sub-assembly testing, providing a standardized, traceable carrier system between the component manufacturer and the final system integrator. Furthermore, they serve as the ideal platform for automated visual inspection and laser marking of modules, ensuring a consistent placement location for high-accuracy machine vision systems. Their robust nature makes them the preferred choice for global logistics and sea freight, where external pressure and environmental fluctuations are common challenges.

Customization:

We offer extensive customization to perfectly match your specific module and process requirements. The internal cell geometry can be precisely tailored to the module's unique shape, ensuring the optimal balance between component protection and tray density. Material selection can be customized for specific thermal profiles, with options available up to 180°C for specialized burn-in requirements, or different polymer grades for chemical compatibility in cleaning processes. We provide options for integrated traceability features, including dedicated molded spaces for 2D barcode or RFID tag embedding, facilitating seamless integration with your Manufacturing Execution System (MES) and Enterprise Resource Planning (ERP) systems.