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ESD Anti Static Semiconductor Waffle Chip Trays

ESD Anti Static Semiconductor Waffle Chip Trays

نام تجاری: Hiner-pack
شماره مدل: HN24171
مقدار تولیدی: 500 عدد
قیمت: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
شرایط پرداخت: T/T
توانایی عرضه: 2000 عدد در روز
اطلاعات دقیق
محل منبع:
چین
گواهی:
ROHS, ISO
وزن سینی:
متفاوت است، به طور معمول تا 500 گرم در هر حفره
رنگ:
مشکی
تضمین کیفیت:
تضمین تحویل، کیفیت قابل اعتماد
اندازه خط رئوس مطالب:
50.8×50.8×3.94 میلی متر
اندازه حفره:
4.64x4.22x0.755 میلی متر
اینکوترمز:
EXW ، FOB ، CIF ، DDU ، DDP
نوع قالب:
تزریق
قابل استفاده مجدد:
بله
شکل سینی:
مستطیل شکل
کلاس تمیز:
تمیز کردن عمومی و اولتراسونیک
نوع آی سی:
BGA، QFP، QFN، LGA، PGA
سطح بسته بندی:
بسته حمل و نقل
Warpage:
Warpage MAX 0.26mm
ظرفیت:
6x7 = 42 عدد
جزئیات بسته بندی:
کارتن، پالت
قابلیت ارائه:
2000 عدد در روز
توضیحات محصول
ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?


Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.


Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24171
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 4.64x4.22x0.755 mm
Matrix QTY 6x7=42 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.


Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services
Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers