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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

نام تجاری: Hiner-pack
شماره مدل: HN24175
مقدار تولیدی: 500 عدد
قیمت: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
شرایط پرداخت: T/T
توانایی عرضه: 2000 عدد در روز
اطلاعات دقیق
محل منبع:
چین
گواهی:
ROHS, ISO
وزن سینی:
متفاوت است، به طور معمول تا 500 گرم در هر حفره
رنگ:
مشکی
تضمین کیفیت:
تضمین تحویل، کیفیت قابل اعتماد
اندازه خط رئوس مطالب:
50.7×50.7×7.4 میلی متر
اندازه حفره:
1.30x1.15x0.72 میلی متر
اینکوترمز:
EXW ، FOB ، CIF ، DDU ، DDP
نوع قالب:
تزریق
قابل استفاده مجدد:
بله
شکل سینی:
مستطیل شکل
کلاس تمیز:
تمیز کردن عمومی و اولتراسونیک
نوع آی سی:
BGA، QFP، QFN، LGA، PGA
سطح بسته بندی:
بسته حمل و نقل
Warpage:
Warpage MAX 0.2mm
ظرفیت:
17x18 = 306 عدد
جزئیات بسته بندی:
کارتن، پالت
قابلیت ارائه:
2000 عدد در روز
توضیحات محصول
ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.


It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.


It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Withstands 125℃ high temperatures.
  • Offers secure IC chip storage.
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24175
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.30x1.15x0.72 mm
Matrix QTY 17x18=306 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.


It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services
Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers