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Clean Production JEDEC IC Trays for Wafer Protection

Clean Production JEDEC IC Trays for Wafer Protection

نام تجاری: Hiner-pack
شماره مدل: HN25012
مقدار تولیدی: 500 عدد
قیمت: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
شرایط پرداخت: T/T
توانایی عرضه: 2000 عدد در روز
اطلاعات دقیق
محل منبع:
چین
گواهی:
ROHS, ISO
وزن سینی:
متفاوت است، به طور معمول تا 500 گرم در هر حفره
رنگ:
مشکی
تضمین کیفیت:
تضمین تحویل، کیفیت قابل اعتماد
اندازه حفره:
322.6×135.9×7.62 میلی متر
اینکوترمز:
EXW ، FOB ، CIF ، DDU ، DDP
نوع قالب:
تزریق
قابل استفاده مجدد:
بله
شکل سینی:
مستطیل شکل
کلاس تمیز:
تمیز کردن عمومی و اولتراسونیک
نوع آی سی:
BGA، QFP، QFN، LGA، PGA
سطح بسته بندی:
بسته حمل و نقل
صافی:
کمتر از 0.74 میلی متر
ظرفیت:
11X26=286 عدد
جزئیات بسته بندی:
کارتن، پالت
قابلیت ارائه:
2000 عدد در روز
توضیحات محصول
Clean Production JEDEC IC Trays for Wafer Protection
Shield delicate semiconductor wafers from dust and damage during production and handling. Maintain clean production environment effectively. Built with sturdy structure to meet JEDEC standards for long-term industrial use. Looking for reliable tray solutions for wafer protection?

Fit automated assembly lines and packaging plants perfectly. Perform steadily in wafer transfer and packaging procedures. Adapt to diverse semiconductor manufacturing processes smoothly.

Enable safe wafer storage and factory logistics. Support custom designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits 
  • Strong durable structure
  • Effective dust prevention
  • Safeguard wafer packaging processes
  • Clean production support
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25012
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4×4×0.75 mm
Matrix QTY 11X26=286 PCS
Warpage MAX 0.74mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor front-end processing, wafer probing, final assembly, and device testing operations. Adapt to cleanroom Class 100/1000 environments, automated material handling systems, and high-temperature manufacturing processes.

Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, foundries, and outsourced semiconductor assembly and test facilities.
Customized Services
Offer end-to-end customization for JEDEC IC trays. Collaborate with engineering teams to define cavity pitch, pocket depth, and material properties for specific wafer sizes and thicknesses. Develop anti-static or high-temperature resistant variants, and validate prototypes through in-house testing. Deliver fully tailored tray solutions that optimize production flow and minimize contamination risks for advanced semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers