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Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

نام تجاری: Hiner-pack
شماره مدل: HN24191
مقدار تولیدی: 500 عدد
قیمت: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
شرایط پرداخت: T/T
توانایی عرضه: 2000 عدد در روز
اطلاعات دقیق
محل منبع:
چین
گواهی:
ROHS, ISO
وزن سینی:
متفاوت است، به طور معمول تا 500 گرم در هر حفره
رنگ:
مشکی
تضمین کیفیت:
تضمین تحویل، کیفیت قابل اعتماد
اندازه خط رئوس مطالب:
50.8×50.8×3.94 میلی متر
اندازه حفره:
8.76x5.51x0.685 میلی متر
اینکوترمز:
EXW ، FOB ، CIF ، DDU ، DDP
نوع قالب:
تزریق
قابل استفاده مجدد:
بله
شکل سینی:
مستطیل شکل
کلاس تمیز:
تمیز کردن عمومی و اولتراسونیک
نوع آی سی:
BGA، QFP، QFN، LGA، PGA
سطح بسته بندی:
بسته حمل و نقل
Warpage:
Warpage MAX 0.26mm
ظرفیت:
4x6 = 24 عدد
جزئیات بسته بندی:
کارتن، پالت
قابلیت ارائه:
2000 عدد در روز
برجسته کردن:

Fine Pitch IC Components ESD Waffle Trays

,

Anti-Static & Dust-Proof Waffle Pack Chip Trays

,

Customizable Cavity Size IC Component Trays

توضیحات محصول
Professional ESD Waffle Trays for Fine Pitch IC Components
Features precision waffle structure to hold fine pitch ICs stably. Effectively blocks particulate contamination and avoids ESD damage during whole process. Made of durable anti-static material to maintain stable performance in various working conditions.

Matches well with automatic production and processing lines. Works smoothly in chip loading, transferring and sorting. Improves operation efficiency and ensures component integrity in daily production.

Accepts full customization on cavity size and arrangement to fit different components. Focuses on safe protection and efficient packaging. Provides professional solutions for high-precision semiconductor applications.
Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24191
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 8.76x5.51x0.685 mm
Matrix QTY 4x6=24 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high-precision chip processing, component sorting, chip testing and small device assembly. Works well in automatic production lines and static controlled workshops.

Ideal for factory internal transportation, finished product storage and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants and electronic component suppliers.
Packaging & Shipping/ Services
Supports customized packaging plans to ensure safe delivery. Protects trays from deformation and damage during long distance transportation.

Provides stable and reliable packaging solutions for bulk orders. Helps maintain product quality and arrives in good condition for customers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers